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Analysis on the generation principle and preventive methods of solder beads in SMT assembly

  • Time of issue:2020-01-13
  • Views:

Analysis on the generation principle and preventive methods of solder beads in SMT assembly

(Summary description)Solder bead (SOLDER BALL) phenomenon is an important defect in the surface mount (SMT) process. It mainly occurs around the chip resistance capacitor (CHIP) and is caused by many factors.Solder bead (SOLDER BALL) phenomenon is an important defect in the surface mount (SMT) process. It mainly occurs around the chip resistance capacitor (CHIP) and is caused by many factors.

  • Time of issue:2020-01-13
  • Views:
Information

Solder bead (SOLDER BALL) phenomenon is an important defect in the surface mount (SMT) process. It mainly occurs around the chip resistance capacitor (CHIP) and is caused by many factors.

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