Analysis on the generation principle and preventive methods of solder beads in SMT assembly

Solder bead (SOLDER BALL) phenomenon is an important defect in the surface mount (SMT) process. It mainly occurs around the chip resistance capacitor (CHIP) and is caused by many factors.Solder bead (SOLDER BALL) phenomenon is an important defect in the surface mount (SMT) process. It mainly occurs around the chip resistance capacitor (CHIP) and is caused by many factors.

Looking forward to the application of automatic printing presses in the era of intelligent electronics

With the rapid popularization of mobile smart terminals, China's mobile Internet application services have quickly formed a huge scale of wearable devices such as smart mirrors, smart watches, and smart bracelets.

How to improve the life of the SMT placement machine

SMT chip mounter price 1. First, the chip mounter (1) should often clean and remove the dust and dirt on the surface of the circuit board and the chip mounter, to avoid the internal heat of the device and the equipment part overheating and burning.

Stencil wiping paper: what are the basic steps of the process of smt stencil

Stencil wiping paper: what are the basic steps of the process of smt stencil?